AI Together: Leading a New Industry Era

COMPUTEX 2026 is connecting global technology and real-world innovation
A Global Flagship Technology Event
COMPUTEX 2026 is taking place in Taipei fro

COMPUTEX 2026 is connecting global technology and real-world innovation

A Global Flagship Technology Event

COMPUTEX 2026 is taking place in Taipei from June 2 to 5, with exhibition areas spanning Taipei Nangang Exhibition Center Halls 1 and 2, Taipei World Trade Center Hall 1, and Taipei International Convention Center. Centered on the theme “AI Together,” the show is focusing on three main pillars: AI & Computing, Robotics & Mobility, and Next-Gen Tech. Together, these pillars are presenting the latest developments in AI technology, from foundational infrastructure and supply-chain integration to real-world industrial deployment.

This year’s exhibition is reaching a new record in scale, bringing together 1,500 exhibitors from 33 countries across 6,000 booths to build an “AI technology ecosystem” spanning R&D, manufacturing, system integration, and end applications. The program is covering AI supply chains, advanced communications, key components, smart solutions, robotics applications, and startup technologies, while connecting the Xinyi and Nangang exhibition districts and demonstrating Taiwan’s pivotal role and innovation capacity within the global AI value chain.

COMPUTEX Keynote: Industry Giants are revealing a new blueprint for the AI ecosystem

This year’s COMPUTEX Keynote is featuring senior executives from leading global technology companies including Qualcomm, Marvell, Intel, and NXP, with four keynote sessions spanning on-device AI, AI infrastructure, edge computing, and physical AI applications. Together, the sessions are outlining the industry’s development blueprint for the AI era.

Qualcomm President and CEO Cristiano R. Amon is opening with a keynote that is presenting the latest positioning of AI computing and next-generation mobile platforms. The address is focusing on on-device intelligence, edge-to-cloud computing performance, and next-generation connectivity, while showing how AI is entering AI PCs, personal AI devices, smartphones, industrial AI, robotics, and other application scenarios.

Marvell Technology Chairman and CEO Matt Murphy is presenting “The Future of AI Scaling Depends on Connectivity” and is appearing on stage with NVIDIA founder and CEO Jensen Huang. Their session is exploring how high-speed interconnects, optical communications, and data infrastructure are becoming essential as AI models and data centers continue scaling.

Intel CEO Lip-Bu Tan is sharing Intel’s strategy for integrated AI systems across devices, the edge, and data centers, focusing on how AI-driven computing is being deployed through PCs, edge devices, servers, and enterprise infrastructure to meet industry demand for performance, efficiency, security, and scalable deployment.

NXP President and CEO Rafael Sotomayor is presenting “Bringing AI into the Real World: The Future of Physical Intelligence,” focusing on how AI is moving from the digital world into real environments. His session is showing how low-latency, low-power, and highly secure technologies are driving smart mobility, industrial automation, smart homes, and autonomous systems. Through these four keynotes, COMPUTEX 2026 is connecting chips, platforms, networking, and edge intelligence to physical AI applications, linking the next phase of competition and collaboration across the AI ecosystem.

COMPUTEX Forum: The largest edition is focusing on eight core themes

This year’s COMPUTEX Forum, themed “AI Together,” is expanding to its largest scale yet, with 28 sessions over three days. It is bringing together senior executives and technology leaders from the world’s top technology companies to analyze how AI is driving the next phase of industrial transformation across AI infrastructure, endpoint devices, data centers, energy management, and industrial applications.

The forum is focusing on eight core themes: robotics and physical AI; AI devices and edge computing; industry-ready AI applications; generative AI and intelligent content; AI factories and data center infrastructure; AI power, energy, and thermal management; data governance, AI storage, and inference foundations; and AI computing platforms and chip-to-rack quality validation. Together, these themes are presenting the AI ecosystem from underlying technology to commercial application.

This year’s speaker lineup is spanning leading global companies including NVIDIA, Microsoft, Google DeepMind, Qualcomm, ABB, NXP, Synopsys, Cadence, Supermicro, Schneider Electric, Infineon, Texas Instruments, Western Digital, Kioxia, and Zeiss. Topics are covering physical AI, edge AI, personalized AI devices, agentic AI, chip design automation, AI data centers, power and thermal challenges, data sovereignty, storage architectures, and AI inference foundations. Through an intensive and comprehensive agenda, COMPUTEX Forum 2026 is becoming a key platform for understanding AI industry-chain transformation, technology deployment, and emerging business opportunities.

Returning to the TWTC Exhibition Area: AI Robotics and smart applications are taking center stage

COMPUTEX 2026 is returning to Taipei World Trade Center Hall 1 and is establishing its first AI Robotics Zone, focusing on physical AI development trends and showcasing real-world scenarios including robotics applications, smart city safety, e-paper displays, and endpoint AI. The TWTC exhibition area is gathering more than 180 exhibitors and is organized around three highlights: the AI Robotics Zone, the E-Paper Industry Pavilion, and the Technology Application and Experience Hall, or TechXperience. These areas are allowing visitors to experience how AI is moving from technology demonstrations to real life and industrial frontlines.

The AI Robotics Zone is connecting sensors, motors, reducers, AI vision, edge computing, and system integration into a complete industry chain. Through live dynamic demonstrations, exhibitors are presenting practical robotics applications in industrial automation, logistics and transportation, medical care, and smart manufacturing. The E-Paper Industry Pavilion is featuring companies such as E Ink, Sharp, and Netronix, which are displaying full-color large-format e-paper signage, low-carbon smart e-paper labels, and medical display solutions. The pavilion is demonstrating the application potential of green display technologies across commercial, lifestyle, and transportation settings. TechXperience is centering on immersive interaction, using AI-driven simulation cockpits and smart application experiences to present how AI is integrating into end-use scenarios.

Major tech companies are connecting the AI supply chain and global business opportunities

This year’s COMPUTEX is bringing together major brands such as ASUS, Acer, MSI, GIGABYTE, BenQ, and ASRock, which are demonstrating AI application strengths built through software-hardware integration. Industry leaders such as Foxconn, Compal, Pegatron, and Wiwynn are showcasing global manufacturing and system integration capabilities while accelerating AI deployment. Benchmark companies including MediaTek, Intel, and Delta Electronics are also depicting a complete industrial ecosystem, from AI computing cores and smart infrastructure to edge applications.

Moving from “AI NEXT” in 2025 to “AI Together” in 2026, COMPUTEX is showing that AI is no longer merely a future-facing technology vision, but is becoming a present force actively reshaping human life. As AI is entering industrial frontlines, smart cities, and daily life, COMPUTEX is connecting international corporations, global technology players, startup teams, professional buyers, and industry experts. The show is presenting the complete picture of AI technology, from infrastructure and key components to smart devices and industrial applications. It is serving not only as an important stage for technology product launches and trend announcements, but also as a key platform for global industry collaboration, supply-chain integration, and real-world innovation.

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