Advancing AI cooling: CPC raises the bar for liquid cooling components. Company to demonstrate innovative quick-disconnect solutions for next-generation liquid cooling applications at COMPUTEX 2025.
Taipei – May 19, 2025 – CPC (Colder Products Company), a global leader in quick-disconnect technologies for high-performance supercomputers and AI superclusters around the world, will showcase its latest innovations at COMPUTEX 2025 (Booth R1226, TaiNEX-2, 4F).
“CPC connection technologies are specifically designed for liquid cooling applications, and they already are used in some of the most sophisticated data center and high-performance computing equipment in operation today,” said Patrick Gerst, General Manager of CPC’s Thermal Management Business Unit.
“CPC has invested further in serving the rapidly growing hyperscale computing needs in Asia-Pacific markets through expanding local technical teams and enhancing its APAC supply network,” he added. “We look forward to connecting with COMPUTEX attendees about innovative ways to cool the chip technologies of tomorrow.”
System-critical components to boost AI cooling efficiency
Advancements in artificial intelligence (AI) increasingly require liquid cooling to manage heat-intensive computing processes. As a result, CPC’s reliable, drip-free connection technologies are in high demand. They are designed to create fast, simple and effective cooling loop connections to help maintain system reliability and offer flexibility in both setup and maintenance.
At the show, CPC will highlight its Everis® LQ disconnect platform, including the recent LQ4S expansion. The stainless steel LQS series offers corrosion-resistant durability in space-constrained environments such as in-blade applications. Additionally, CPC’s LQ elbow series offers compact, high-flow solutions ideal for in-rack manifold hose routing in hyperscale data centers.
Image: CPC Everis® LQ4S
CPC will also feature its next-generation UQDB04 and UQD06 quick disconnects, designed for interoperability and high-flow cooling to support advanced chip technologies. Unique CPC reliability features include a patented spill-proof valve, 100% helium leak testing, and parts serialization.
Image: CPC Everis® UQD – Blindmate Style
Driving OCP UQD v2.0 specification with expert knowledge
CPC has nearly 50 years of expertise in developing quick disconnect technology and continues to innovate its products and liquid cooling approaches for the industry.
“AI demands highly specialized knowledge to address rising challenges in standards and best practices for system-critical components,” said Gerst. “CPC is trusted in these high-stakes applications because we understand the industry and the specific requirements of liquid cooling. We have the capacity and know-how to support AI’s incredible growth and progress.”
CPC’s dedicated Principal Thermal Technologist, Elizabeth Langer, serves as a leading consulting contributor on the OCP UQD v2.0 workstream and is a key partner to several major leading AI and HPC innovators. CPC was also a key member in the creation of liquid cooling reference designs in 2018, which were ultimately contributed to OCP as the first UQD specification.
CPC will be represented by its local distributor, Century Automation Corporation, at the COMPUTEX show. For more information about the performance and versatility of CPC’s liquid cooling solutions or any of the other 10,000+ innovative connection solutions CPC offers, visit www.cpcworldwide.com/taiwan.
